| Full Name | 7400B Wire Bonder |
|---|---|
| Category | Other |
| Description | This instrument is an ultrasonic wedge wire bonder designed to bond wire leads between contact pads of packages, ICs, hybrid, microwave and MEMS devices. This instrument has an Olympus SZ-STB1 stereomicroscope with 0.9-4X zoom. |
| Location | HSCI-261 |
| Contacts | Primary:
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| Cost of Operation | |
| Training Needed | Please contact Dr. Chuhee Kwon for specific training. |
| Manufacturer | West Bond |